| 摘要 |
<p>A wire is positioned alongside a plastic member which carries a conductor, and a portion of the wire is driven sideways into the plastic so that the wire engages against the conductor and is held in place by embedment in the plastic. The wire may be driven into the plastic by a heated tool or by ultrasonic vibration. A particular use of the invention is the connection of wires to circuit runs of printed circuit boards, such as in the FlipFlash photoflash array.</p> |
