发明名称 REMOVING METHOD FOR HIGHHMOLECULAR MOLDING MATERIAL
摘要 <p>PURPOSE:To remove molding material without injuring an inner matter by making dry distillation of the molding material composed of high-molecular substance being used as coating material. CONSTITUTION:Into an electric furnace heated at 400-430 deg.C is inserted a test tube 2 in which there is placed a matter 6 such as a semiconductor molded by high-molecular substance composed of thermosetting resin. A glass tube 3 is inserted near the bottom of the test tube 2, air is sent from the glass tube 3 at 20-30ml/min to make dry distillation of the high-molecular substance. Then, the molded matter is taken out and the high-molecular substance is removed by ultrasonic cleaning.</p>
申请公布号 JPS5593415(A) 申请公布日期 1980.07.15
申请号 JP19790001571 申请日期 1979.01.08
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HATSUTORI SHIYUUJI
分类号 B29B11/00;B29B17/02 主分类号 B29B11/00
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