| 摘要 |
<p>PURPOSE:To improve the working efficiency by making well arrangement of the polarity of each lead, by constituting an otugoing lead of the semiconductor device employing non-mangetic material. CONSTITUTION:Nickel-metalized layer 2 and proturded electrode of silver 3 are etablished on one principal surface and the other principal surface of semiconductor substrate 1 respectively. Of the leads formed in a single solid body of heat sinks 4a, 5a, lead 4 shall be Dumet wire and lead 5 copper wire. Lead 4 is magnetized and substrate 1 is adhered on heat sink 4a with nickel layer 2 placed right under the said substrate 1. Following this process, glass casing 6 is placed over and the magnetic field is eliminated. Then heat sink 5a with the lead 5 is sealed. Under this constitution, it is possible to magnetically distinguish and arrange the polarity of leads.</p> |
