发明名称 LEAD FRAME
摘要 PURPOSE:To obtain leads of large width nucessary for automatic wire connection, although lead space is narrow, as far as circumstances allow, on a lead frame for LSI equipped with numerous leads. CONSTITUTION:Tab 1, for pellet connection lead 2 connected to each other on its top part 3 surrounding the tab and formed in a terminal lead except for the connection part, and frame 4 are fabricated by pressing a metal sheet. Next, a cut edge is sized up and sheared from the top part 3 by means of punch and die corresponding to the top width of each lead. Then each lead is formed with every other lead slightoy bent, at the middle part 5 of its length, upward on the plane of the frame. Under this constitution, the incidence of short-circuit is reduced during assembly process handling or resin sealing. In addition, it is easy to provide the press die and to maintain thereof.
申请公布号 JPS5593245(A) 申请公布日期 1980.07.15
申请号 JP19790000803 申请日期 1979.01.05
申请人 发明人
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
代理机构 代理人
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