| 摘要 |
PURPOSE:To avoid damage and blocking to be caused on the lead wire by constructing the bonding tool for feeding conductors between semiconductors with a linear fine hole at the lower end and a ceramic member having a tapered fine hole specified in its opening so as to be communicated therebetween. CONSTITUTION:A fine hole 12 for feeding conductors is formed to pierce vertically through a ceramic body 11 made of sintered powdered alumina. In this process, the fine hole 12 is so arranged to have a portion 12a opened straight through the lower end thereof and a tapered portion 12b at the center thereof communicated thereto in such a manner to be expanded within the opening range of 10 deg.. In addition, an broad straight conductor insertion port 12c is formed at the upper end thereof connected to portion 12b. With such an arrangement, a gold wire 13 passing through the fine hole is made free from damages, scratches and the like. Besides, a tensile strength can be obtained at a level comparable to the ordinary tool having the fine hole 12 entirely tapered. |
