发明名称 ETCHING METHOD
摘要 PURPOSE:To form a fine evenly etched pattern with a high accuracy by treating material to be etched with an organic liquid having an affinity both to the resist and etching liquid after a resist pattern is formed thereon. CONSTITUTION:A chrome film 12 and a chrome oxide film 13 are evaporated on a glass substrate 11 in sequence to form a mask base material. Thereafter, a resist film is formed on the mask base material. Then, an electron beam is irradiated on a desired portion of the resist film to engrave a pattern. Thus, a resist pattern 14 is formed. At the same time, a scum 15 is left on the pattern region. Then, after immersed into an organic solution having an affinity both to the resist and etching liquid, the mask base material under-goes a wet etching to make a photomask. Accordingly, it is possible to form a mask pattern 16 of high quality with a high accuracy which follows closely to the resist pattern 14.
申请公布号 JPS5591127(A) 申请公布日期 1980.07.10
申请号 JP19780163300 申请日期 1978.12.27
申请人 CHO LSI GIJUTSU KENKYU KUMIAI 发明人 HIDEYAMA AKIZOU;MIURA AKIRA;TOUKAWA IWAO
分类号 C23F1/00;G03F1/00;G03F1/68;G03F1/80;H01L21/306;H01L21/308 主分类号 C23F1/00
代理机构 代理人
主权项
地址