| 摘要 |
<p>To obtain openings or outlines in ceramic substrates (1) and to avoid the known pressing operations, use is made of optical laser beam pulses (4) which are applied to said substrates. Each pulse produces a hole (O) in the substrate. Either the light beams or the substrate are moved along a line of movement (F1, F2) corresponding to the opening or outline to be executed. The perforation is advantageously commenced in a substrate zone intended to be removed. <IMAGE></p> |
