Adhesive composition

摘要

Adhesive composition, comprising the following ingredients (wt. %): low molecular dianic epoxy resin as a binder: 20.0-50.0 a mixture of phenyl-glycidyl ether and aliphatic epoxy resin taken in the weight ratio of (0.5 to 1.5):1 used as a plasticizer: 2.0-15.0 polyethylene polyamine as a hardener: 2.0-8.0 aluminium oxide modified with chromium oxide and having the form of a powder with a minimum particle size of 50 mu , used as a filler: 25.0-60.0.