| 摘要 |
PURPOSE:To obtain a highly reliable device without problems like disconnection and to increase the productivity by a method wherein a resin is filled and moulded after having inserted an electronic component in a mould of circuit substrate. CONSTITUTION:With the external outlet electrode looking downward, a semiconductor chip 2 is placed on a lower mould 11 which is provided with locating pins 10, the chip 2 being surrounded by the pins 10, on which an upper mould 12 is covered and then clamped. A resin A is filled through an inlet 13, which is formed on the upper mould 12, to form a buffer layer over the surface and side face of a chip 2. Then, the upper mould 12 is removed and the resin A solidified in the shape of the inlet 13 is removed. After that, another upper mould 15 is clamped similarly and a resin B is filled through this inlet 16 to make a circuit substrate 17 by surrounding a layer 14. Then, the upper mould 15 is removed to free the substrate 17 from the lower mould 11. After having removed the resin B remained in the shape of the inlet 16, the substrate 17 is turned around to match with the electrodes exposed herein resulting in the printing and formation of a wiring pattern 18. |
