MULTILAYER PRINTED WIRING BOARD

摘要

A MULTILAYER PRINTED WIRING BOARD This application discloses a multilayer printed wiring board having a plurality of pattern layers. Said printed wiring board has at least one pair of plated through holes, i.e. a first and a second plated through hole. The first plated through hole is directly connected to said patterns. The second plated through hole is not directly connected to said patterns. An electronic element terminal is connected to said second plated through hole. The first and second plated through holes are electrically connected to each other on a surface opposite an element mounting surface of the printed wiring board.