SEMICONDUCTOR DEVICE IN PLASTIC PACKAGE

摘要

An integrated circuit chip having circuit elements capable of relatively high power operation is encapsulated in a body of polymeric material having the form of an elongated prism. Conductors are electrically coupled to the circuit elements in the chip and extend outwardly of the body through a relatively long side thereof. A heat conducting stud is anchored in the body and is thermally coupled to the chip. The stud extends outwardly of the package through another of its relatively long sides. A heat sink may be coupled to the stud outside of the package.