| 摘要 |
<p>PURPOSE:To make it possible to align a substrate on the basis of the detected data, by detecting the amount of the eccentricity between the semiconductor substrate and a wafer chuck and the position deviation of an orientation flat with the wafer chuck provided with a line sensor. CONSTITUTION:A line sensor 3 is provided in the radial direction of a wafer chuck 2. A semiconductor substrate 1 is sucked at a position having an amount of eccentricity C with respect to the chuck 2. The chuck 2 and the semiconductor substrate 1 as a unitary body are rotated in the counterclockwise direction with the center of the chuck 2 as the center of rotation. Then, the amount of the received light in the line sensor 3 is changed with respect to the rotating angle. The amount of eccentricity C can be obtained from the difference between the amounts of received beams of light at the rotating angles of 90 deg. and 270 deg.. The position of the center of an orientation flat 1a can be obtained from a rotating angle theta of the maximum amount of the light in the curve of the orientation flat part. When the chuck 2 is rotated in the counterclockwise direction by the rotating angle theta, amounts of eccentricities D and E become D=C.costheta and E=C.sintheta. The substrate 1 is mounted under the state wherein a conveying mechanism 5 is moved by the amount of the eccentricity. The conveying mechanism is returned to the specified position with respect to a wafer chuck 6, and the semiconductor substrate 1 is mounted on the chuck 6.</p> |
