| 摘要 |
<p>PURPOSE:To improve the moisture resistance of a product by forming a trench crossing the surface of a lead near a wire connecting section for the lead for connection through a wire with a semiconductor pellet. CONSTITUTION:Trenches 8 are shaped so as to cross the surfaces of leads 1, 2 for a resin seal transistor in the vicinity of bonding sections for the leads 1, 2. According to the constitution, when moisture intends to infiltrate through the clearances of A resin sealing body 5 and the leads 1, 2, infiltrating moisture is stopped by the trenches 8 shaped so as to cross the surfaces of the leads while the mileage of the leads 1, 2 and the resin sealing body 5 is spread, and bonding strength is increased, thus improving the moisture resistance of a product.</p> |
