| 摘要 |
<p>PURPOSE:To split a semiconductor substrate satisfactorily by a method wherein the substrate having a scribed groove is sandwiched in between plastic films and difference in air pressure is provided between both sides. CONSTITUTION:A substrate 2 having a scribe groove 1 on the under surface is sandwiched in between 2 sheets of pressure sensitive adhesive plastic films 3, 3' removing air bubbles. After placing the films 3, 3' between a vessel 5 and a lid 7 simultaneously discharging air 4, 6, the air is gradually introduced 6 into the lid side 7, then the substrate is divided into chips 8 because the films are curved. This constitution prevents the chips from being broken and damaged because no pressure is added by a hard roller.</p> |
