| 摘要 |
PURPOSE:To grind a semiconductor wafer by such manner as covering the face of a holder in contact with the wafer with a given matter and pressing it against a rotary table. CONSTITUTION:Alumina or the like with grade 3000 or so is suspended to a slurry in water or that in which glycerol is mixed i small quantities and then supplied to a device. The face of a holder 4 mounted on a rotatable spindle 3 which comes in contact with a wafer is covered with polyurethane foam 5 the front layer of which is polyurethane having a suede surface. Since the surface is moistened with slurry, this matter is effective enough to hold the wafer closely at the time of grinding. According to this method, it is not necessary to wash out an adhesive after grinding.
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