| 摘要 |
<p>The machine may effect the precision slicing of a mono-crystalline silicon block (1), utilising a series of co-planar horizontal axially displaceable abrasive wires (9) at definite gap centres. Precision is enhanced by using a roller (20) to position the individual wires at the start of the cuts, the roller supporting the wires (9) whilst contact with the block (1) is made. The roller axis is horizontal and normal to the longitudinal wire axis, and it provides circumferential grooves locating individual wires. The line of contact between the roller and the wires is parallel to the roller axle and nominally offset from the line of initial contact between the wires and the block. Once the cuts are started the roller may be retracted (20'), being mounted on a pivotable arm (18) controlled by a racked (22) ink (21) to a motor (24) driven pinion (23).</p> |
