| 摘要 |
<p>Mixing vinyl-containing polyorganosiloxane, a silicon-bonded hydrogen containing organosilicon compound, a platinum catalyst, a polysiloxane having at least one silicon-bonded vinyl radical and at least one siliconbonded hydroxyl radical and an epoxy-containing, alkoxy silane provides a composition which exhibits improved adhesion to many substrates without the aid of a primer when heat cured in contact with the substrate. These compositions are useful as encapsulants for electrical and electronic components, as electrical insulation and as potting materials.</p> |
