发明名称 NAIL HEAD BONDING PROCESS
摘要 PURPOSE:To improve the workability of a nail head bonding process by cooling a hydrogen supplying tube to a torch by an electronic cooler. CONSTITUTION:A direct current is applied to an electronic cooling element 9 to thereby cool a cooling plate 10 to approx. -30 deg.C. to thereby retain hydrogen fed through a tube 14 brazed to the plate 10 to a torch 3 below the freezing point so as to dew steam contained therein and to thereby remove it into a reservoir 15. When a gold ball is formed by hydrogen flame 4 produced by the hydrogen thus dried, no foreign material is adhered onto the surface to thereby conduct preferable nail head bonding process.
申请公布号 JPS5583245(A) 申请公布日期 1980.06.23
申请号 JP19780157255 申请日期 1978.12.19
申请人 发明人
分类号 H01L21/60;H01L21/603 主分类号 H01L21/60
代理机构 代理人
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