| 摘要 |
PURPOSE:To form a uniform sputtering coating without producing residue by etching, by providing sticking prevention board forming opening part between the target and substrate holder so as to be exposed facing only semiconductor substrate against the target. CONSTITUTION:The rotary type holder 3 arranged many semiconductor substrates 5 on the side face at a fixed position facing against the target 2, such as SiO2 etc., making the cathode 2a and the permanent magnet 2b as backing plate, is provided in the vacuum vessel 1 enclosed diluted Ar gas. The sticking prevention board made of stainless steel etc. forming the opening part 3a between the target 2 and the holder 3, is provided so as to be exposed only the substrate on the target 2. As a result of it, the substrate 5 is exposed in the region (I) forming uniform and good sputtering coating and coating formation in the region (II) forming undesirable coating, is prevented. Thus, dense sputtering coating is formed on the substrate 5. |
