| 摘要 |
An improved semiconductor rectifier arrangement of the type in which two unencapsulated rectifier elements, each having at least one pn-junction, are each fastened, via respective metal contact discs and in a manner that insulates the rectifier elements electrically and provides good heat conductance, on a common cooling member provided with coolant passages in which each rectifier element is connected at its upper connecting terminal to another rectifier element via a current conductor fastened on the contact disc associated with the other rectifier element to form an antiparallel circuit, and in which the structure comprising the cooling member, the rectifier elements and the current conductors is embedded in an insulating mass. Each contact disc bearing a rectifier element is provided with a connecting member for connecting the rectifier arrangement with current conductors, and is fastened to a suitably metallized surface section of a wafer made of a thermally good conducting electrical insulating material. The cooling member is provided in the form of a plate and has in its interior, at least in the region of the contact discs, a plurality of interconnected coolant channels which are parallel to one another and to the contact surface of the contact discs and which are provided with connections for external coolant lines. The structure which is intended to be embedded in an insulating mass is disposed in a housing of insulating material which is provided with suitable openings for the passage of the connections for the cooling member as well as for the connecting members for the contact discs, and is embedded in a cast plastic mass. |
