| 摘要 |
A modular microstrip transmission line circuit arrangement wherein each pair of modules includes: A microstrip circuit having a dielectric substrate with strip conductor circuitry formed on one side and a ground plane formed on the other side; and a support structure, the ground plane being affixed to a surface of the support structure. A portion of the ground plane of each module protrudes from an end of its support structure. A conductive gasket is disposed between the pair of modules beneath the protruding portions of the ground planes. A second resilient gasket is disposed between the conductive gasket and a base to force the conductive gasket against the protruding portions of the ground planes when the modules are fastened to the base, such conductive gasket providing a continuous ground plane between the pair of modules. A conductive strip is bonded to the ends of adjacent strip conductors to complete the electrical circuit between the pair of modules. With such an arrangement an individual module may be easily replaced from the base.
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