发明名称 |
High density integrated circuit package |
摘要 |
A high density integrated circuitry package is disclosed where gates containing the circuit cards are rotatably mounted in the cabinet with some of the gates fixed to a central core and other gates pivoted to the core. The pivoted gates are extendable outside of the cabinet for diagnostic and maintenance purposes and for simultaneously providing access to the fixed gates.
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申请公布号 |
US4208079(A) |
申请公布日期 |
1980.06.17 |
申请号 |
US19790005946 |
申请日期 |
1979.01.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP |
发明人 |
PRADO, PHILIP G;STUCKEY, RAYMOND L;VOLLES, FREDRICK O |
分类号 |
H05K7/14;H05K7/16;(IPC1-7):H05K7/16 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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