| 摘要 |
PURPOSE:To reduce cost and weight by forming a part having metal wirings formed of conductive paste or the like on a board and at least in contact with a metal bump of an IC chip of the wirings in an uneven shape, and electrically connecting in the shape buried in the bump of the chip. CONSTITUTION:After phenol resin paste containing Cu particles is printed by a screen method on a glass board 1 which transmits a wavelength of approx. 365nm, electric wirings 2 are provided by baking. Light curable epoxy resin 3 having absorption of a light having 365nm of wavelength is dispensed on a semiconductor chip 4 having bumps 5 made of gold, aligned with the wirings, and a load is applied to bring the board 1 in close contact with the chip 4. Thereafter, it is radiated from a high pressure mercury lamp having a light emitting peak at 365nm of wavelength from the side of the board, and an IC chip is mounted. Thus, an IC having a low cost and high manufacturing yield can be mounted. |
