| 摘要 |
<p>PURPOSE:To use a silicon substrate, when giving cuts to the semiconductor side thereof with a dicing saw for pelletization, for elongating the lifetime of the saw and easily setting cutting depth. CONSTITUTION:A silicon substrate 1 is heated to 100-120 deg.C and coated with electron wax 2. A semiconductor wafer 3 to be pelletized is adhered to the substrate 1 with wax 2. The substrate 1 and wafer 3 are cooled while pressed for tight adhesion. The wafer 3 is set on a dicing machine and cut with a dicing saw. This cutting is made up to a part of the substrate 1, starting from the surface of the wafer 3, and the wafer 3 is divided into pellets 4.</p> |
