发明名称 LIGHT-SENSITIVE POLYAMIDE RESIN COMPOSITION
摘要 <p>Light-sensitive polyamide resin composition, which contains polyamide containing in the molecular chain 10 - 70 wt% polyoxyethylene segment or poly(oxyethylene/oxypropylene) copolymer segment having a number-average molecular weight of 150 - 1,500 and a photo-polymerizable unsaturated compound. This composition provides a printing plate having an excellent softness, good developability with water alcohol or the like, and excellent transparency, toughness, and durability. </p>
申请公布号 WO1980001212(P1) 申请公布日期 1980.06.12
申请号 JP1979000307 申请日期 1979.11.30
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