发明名称 THREE-DIMENSIONALLY STRUCTURED MICROELECTRONIC DEVICE
摘要 <p>A large scale parallel architecture in which many parallel channels operate simultaneously to create a natural and efficient organization for processing two-dimensional arrays of data. The architecture comprises a plurality of stack integrated circuit wafers (16, 18) having top and bottom surfaces, electric signal paths (20) extending through each of the wafers between the surfaces, and micro-interconnects (50) on the surfaces of adjacent wafers interconnecting the respective electric signal paths with a topographical one-to-one correspondence. </p>
申请公布号 WO1980001220(A1) 申请公布日期 1980.06.12
申请号 US1979001012 申请日期 1979.11.13
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