发明名称 METHOD FOR MANUFACTURING ELECTRONICS LEAD
摘要 A method of preventing the natural oxidization of the lead surface and developing the tensile stress is speciallized that a lead is coated with the Sn-Pb mixed alloy(50 to 50) around the lead(1) of cu or Cu alloy to increase the selfmalleability and coated afterwards with 100 % pure Sn(3) having 1-2 μm depth on the surface(2) to prevent from exposing an easily oxidizable Pb in the air.
申请公布号 KR800000520(B1) 申请公布日期 1980.06.12
申请号 KR19790000474 申请日期 1979.02.15
申请人 HWANG SUNG PARK 发明人 HWANG SUNG PARK
分类号 H01B5/00;(IPC1-7):H01B5/00 主分类号 H01B5/00
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