| 摘要 |
Disclosed is a method for mounting electronic components comprising steps of sucking an electronic component such as semiconductor pellet to the tip end of an attraction nozzle, holding and automatically orienting the sucked electronic component by means of a plurality of arms arranged along the outer periphery of the tip end of the sucking nozzle, transferring the held electronic component to a predetermined bonding portion of a semiconductor device substrate such as stem, and opening the arms to bring down the electronic component onto the predetermined bonding portion for bonding. Also disclosed is an apparatus for executing this method. |
