| 摘要 |
PURPOSE:To improve temperature dependency of pair characteristics, by securely fixing plural semiconductor elements onto an insulating board of good thermal conductivity, such as beryllia, etc. CONSTITUTION:A beryllia board 5 of good thermal conductivity is fixed onto a prescribed section of an inner lead 4 of plural external draw-out leads 1, and a semiconductor element 2 is separated and fixed. The lead wire 1 and the element 2 are connected by a wire 3 and sealed by epoxy resin 6. As it is possible, in this mechanism, to increase number of connecting wires by 2 pieces as compared with the conventional 2-chip method, the defect of poor temperature dependency of pair characteristics can be eliminated, and therefore, a device of good characteristics can be obtained. |
