发明名称 Circuit board with baseplate surface lined with foil - has thin film elements on printed circuit board with printed wiring linked to foil elements via metallised holes
摘要 <p>The electric circuit board is made from a mechanically stable baseplate with a top surface lined with a foil. There is a flat surface structure deposited on one of the surfaces of the foil. The components are connected into layer circuit sections in a rational way. The baseplate has a printed circuit board (1) with printed wiring (7) on one of the main surfaces. The continuous holes (9) extending through the foil lining into the printed circuit board. The walls of the holes are metallised so as to link certain sections of the foil circuit structure (4a, 4b) to the wiring on the printed circuit board. The components on the foil lining are produced by thin film techniques.</p>
申请公布号 DE2846703(A1) 申请公布日期 1980.06.04
申请号 DE19782846703 申请日期 1978.10.26
申请人 SIEMENS AG 发明人 LOHSE,HARTWIG
分类号 H05K1/00;H05K1/16;H05K3/00;H05K3/20;H05K3/42;(IPC1-7):05K7/02 主分类号 H05K1/00
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