| 发明名称 |
METHOD OF ALTERING SOLDER ALLOY COMPOSITION TO FORM SOLDER BOND |
| 摘要 |
1. Method for the in-situ modification of the composition of a solder alloy containing lead and a wetting agent, characterized in that the solder alloy is heated in molten form for a sufficient time in contact with a fluxing agent to reduce the content of the wetting agent in the molten solder. |
| 申请公布号 |
JPS5574160(A) |
申请公布日期 |
1980.06.04 |
| 申请号 |
JP19790102850 |
申请日期 |
1979.08.14 |
| 申请人 |
IBM |
发明人 |
NIKORASU JII KUUPUMAN;BINSENTO SHII MAAKOTSUTO;SUTEIIBUN TEIIDO |
| 分类号 |
H05K3/34;B23K1/00;B23K35/26;B23K35/36;B23K35/363;H01L21/60;H01L23/485;H01L23/488 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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