| 摘要 |
<p>PURPOSE:To prevent occurrence of crack due to dicing process, to enable it to be cut perfectly and to improve recovery rate, by covering surface of a semiconductor substrate with plastics. CONSTITUTION:A wafer 11 is attached to a joining tape 12, and by perfectly cutting it from the direction of A', it is divided into a rod-like body 13. Plastics, such as wax 5, etc., is made to drip onto an entire surface of the rod-like body 13 and gaps among the rod-like bodies 13 are also filled with the plastics. After solidification of the wax, if it is perfectly (or completely) cut from the direction of B', since the gaps are filled with wax, force of a cutter 14 is dispersed and not applied separately on each individual rod-like body, and therefore, possible occurrence of crack of the wafer 11 is diminished. By removing by using an organic solvent and separating it from the joining tape, each individual pellet can be obtained separately.</p> |
