发明名称 PRINTED CIRCUITS AND METHODS THEIR MANUFACTURE
摘要 <p>This is directed to an electronic circuit apparatus using a flexible printed wiring board having a conductive leaf formed on the surfaces of a flexible base material such as phenol resin or the like, wherein a circuit conductive leaf is formed on at least the single face of a flexible base material and a peripheral edge leaf is formed on the periphery of the flexible base material. An electronic parts is mounted and connected to the circuit conductive leaf. Since the flexible base material is extremely thin and flexible, the electronic circuit apparatus can be constructed smaller and thinner.</p>
申请公布号 GB2034127(A) 申请公布日期 1980.05.29
申请号 GB19790035512 申请日期 1979.10.12
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO LTD 发明人
分类号 H05K1/00;H05K1/02;H05K1/11;H05K3/00;H05K3/06;H05K3/34;(IPC1-7):05K1/00;05K3/00 主分类号 H05K1/00
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