| 摘要 |
<p>PURPOSE:To prevent a support base from being marred by rotary blade with an insulating material interposed therefor by an arrangement wherein a dicing depth can be detected even from interposing an elastic insulating material like adhesive tape between a matter to dice (semiconductor wafer for example) and support base by means of capacitance measuring system. CONSTITUTION:A matter 6 to dice or semiconductor wafer for example is placed on a conductive support base 2 by way of an elastic insulating material 4 like adhesive tape. The matter 6 is diced with a conductive rotary blade 8. A distance between both the blade 8 and the support base 2 is measured with a measuring equipment 10 with reference to a capacitance between them, and the measured value is indicated on a display 12. A desired dicing depth h is set with a setting apparatus 16, and the blade 8 is controlled for dicing depth h through a controller 18 so that a deviation between the set value and an actual value obtainable through an arithmetic unit 14 to convert the measured value detected on the measuring equipment 10 to the dicing depth h will be zero.</p> |
