| 摘要 |
PURPOSE:To prevent a fine metallic wire from breaking by a method wherein the fine metallic wire connected to an electrode face formed on a semiconductor chip through the first ball bonding is connected to the internal lead of a package through the second stitch bonding, and then a cutting by laser beam and a ball formation on the side end of the wire are carried out simultaneously under a no-load state. CONSTITUTION:A guide 7 provided over a capillary 5 works roughly for a fine metallic wire. A consumption zone is cut off a fine wire material zone 2 under a no- load state by a laser beam arriving from the direction 8 indicated by arrow after the second stitch bonding is finished, and a ball is formed. The laser beam is adjusted through an optical lens and irradiated at about 2J in strength sidedly or obliquely as a flux of light two times or over as big as the fine metallic wire size. |
