发明名称 |
ACID COPPER PLATING BATHS |
摘要 |
<p>An acid plating bath and an improved process for electrodepositing level copper coatings are described. The improved copper plating baths and method include a bath soluble organic leveling compound which is obtained by reacting one or more epihalohydrins with one or more nitrogen-containing compounds which may be substituted pyridines, quinolines, isoquinoline or benzimidazole. Particularly improved results are obtained if the acid copper bath also contains, in addition to the leveling agent, a bath-soluble brightening agent and a wetting agent. The presence of the above-described leveling agent in acid copper plating baths produces a lustrous, smooth and level deposit of copper over a wide range of current densities.</p> |
申请公布号 |
CA1078323(A) |
申请公布日期 |
1980.05.27 |
申请号 |
CA19770270766 |
申请日期 |
1977.01.31 |
申请人 |
ROHCO, INC. |
发明人 |
ECKLES, WILLIAM E.;STARINSHAK, THOMAS W. |
分类号 |
C07D215/00;C07D213/16;C07D213/50;C07D213/53;C07D213/55;C07D213/61;C07D213/70;C07D213/73;C07D213/81;C07D213/83;C07D213/84;C07D235/00;C25D3/38;(IPC1-7):25D3/38 |
主分类号 |
C07D215/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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