发明名称 MOUNTING METHOD OF SEMICONDUCTOR
摘要 PURPOSE:To minimize the length of external lead terminals of a semiconductor chip which is mounted, by causing a heavy current to temporarily flow through a connection line to cut it off and stabilize the electric condition of a control terminal of the chip. CONSTITUTION:After a semiconductor chip 9 mounted on a common pattern 5 is connected to external control terminals 8, the common pattern 5 is connected to the terminals 8. When a voltage lower than the maximum rating of the semiconductor chip is applied to only a control terminal 8 required to be disconnected from the common pattern 5, a heavy current flows through only the connection line between the control terminal 8 and the common pattern 5 to melt off the connection line. According to the present method, the input state of the control terminal is fixed much easily than by convertional methods and the length of each external lead terminal is minimized. This results in providing a margin for other petterns.
申请公布号 JPS5568644(A) 申请公布日期 1980.05.23
申请号 JP19780142994 申请日期 1978.11.20
申请人 SUWA SEIKOSHA KK 发明人 MIYASAKA MITSUKO
分类号 H01L21/60 主分类号 H01L21/60
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