| 摘要 |
PURPOSE:To satisfy the various requirements of IC lead wires by containing predetermined amounts of Fe, Sn, P and Cu in the lead wire. CONSTITUTION:The content is represented by weight percent. 0.5-1.5% of Fe is contained in the lead wire material for an IC to thereby secure predetermined Vickers hardness, elongation, heat resistance, and corrosion resistance thereof. 0.5-1.5% of Sn is contained therein to thereby suitably secure conductivity in addition to predetermined hardness and elongation. 0.01-0.35% of P is contained therein to thereby prevent precipitation of oxide in the crystal and crystal boundary and improve the hot workability and strength of strip blank. The residue contains Cu and unavoidable impurities. Thus, when Cu alloy is used for the IC lead wire, it carries out high strength, heat resistance, terminal conductivity (electric conductivity) and corrosition resistance. |
