| 摘要 |
1,126,092. Thermocouples. MINING & CHEMICAL PRODUCTS Ltd. 21 Aug., 1967 [2 Sept., 1966], No. 39225/66. Heading H1K. [Also in Division C7] In making a thermoelectric device operating using the Peltier or Seebeck effect, an electroplating resist pattern 5 (and 6) is applied to each major face of an assembly, e.g. matrix 1 of pairs of P- and N-type semi-conductor thermoelements, prior to electrodepositing metallic connecting links 10 on the major faces in an electro-plating bath. The resist pattern is preferably of grid form covering some of the lines of insulating bonding material separating the theimoelements with apertures corresponding to the desired commutation of links; the resist material may be a resin ink applied by silkscreen printing and dried or cured, a photosensitive resist material, " stop-off " lacquer or ceramic paint. Conducting bridges (7), e.g. dots of Ag may be formed, e.g. by printing of an air-drying Ag suspension to connect the thermoelements of each pair and adjacent pairs, prior to connecting input and output leads 3 (and 4) of assembly together and placing in the electroplating bath. First Ni links 8 0À0001 to 0À0005 inch thick may be electrodeposited in the grid apertures, then Cu links 10 0À005 inch thick over the Ni links. The Cu links may be finally ground or lapped. |
