发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To prevent deterioration in moisture resistance and acid resistance due voids and to stabilize a device, by brazing lead wires coated with brazing filler metals to the electrodes of a semiconductor element, and sealing the element and parts of the lead wires into a glass container. CONSTITUTION:The tip parts of lead wires 16 are coated with brazing filler metals 18. The lead wires 16 are connected to electrodes 14 on both sides of a thermistor element 12. The thermistor element 12 to which the lead wires 16 are fixed is placed in a glass cap 22. The glass cap 22 is fused with a carbon heater 24. Thus, the radial type thermistor 10 sealed with a glass coating 22' is obtained.</p>
申请公布号 JPH01230258(A) 申请公布日期 1989.09.13
申请号 JP19880055819 申请日期 1988.03.09
申请人 MURATA MFG CO LTD 发明人 YONEDA YASUNOBU;BABA YUKIO;SAKABE YUKIO
分类号 H01L23/29;H01L23/31;H01L23/48 主分类号 H01L23/29
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