| 摘要 |
<p>THERMAL HEAD APPARATUS A thermal head apparatus is disclosed which comprises a heating resistor block provided with a plurality of heating resistors divided into plural groups, a diode array block provided with a plurality of diodes corresponding in number to the plurality of heating resistors, a conductor block provided with selective conductors for supplying selectively to the heating resistors, and a film carrier or the like provided with a plurality of conductors for connecting the heat resistors with the diodes and the diodes with the selective conductors. Thus, it is made possible as a result of forming each part in a block to make the apparatus compact and the manufacturing cost low.</p> |
