发明名称 |
Bubble generating tunnels for cooling semiconductor devices |
摘要 |
A structure for cooling high density integrated circuit devices composed of a heat sink bonded to the backside of the integrated circuit devices. The integrated circuit devices are mounted on a board and the board positioned so that the tunnels in the heat sink are oriented vertically. The tunnels are totally immersed in a liquid so that the integrated circuit devices are cooled by nucleate boiling and bubbles form within the tunnels and propagate out of the tunnels.
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申请公布号 |
US4203129(A) |
申请公布日期 |
1980.05.13 |
申请号 |
US19780923592 |
申请日期 |
1978.07.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP |
发明人 |
OKTAY, SEVGIN;TORGERSEN, GERARD J;WONG, ALEXANDER C |
分类号 |
H05K7/20;H01L23/42;H01L23/427;H01L23/44;H01L23/473;(IPC1-7):H01L25/04;H01L39/02 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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