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发明名称
PACKAGING DEVICE FOR SEMICONDUCTOR INTEGRATED CIRCUIT
摘要
申请公布号
JPS5561043(A)
申请公布日期
1980.05.08
申请号
JP19780134160
申请日期
1978.10.30
申请人
MITSUBISHI ELECTRIC CORP
发明人
HATSUTA MUNEO
分类号
H01L23/32
主分类号
H01L23/32
代理机构
代理人
主权项
地址
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