首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
PACKAGING DEVICE FOR SEMICONDUCTOR INTEGRATED CIRCUIT
摘要
申请公布号
JPS5561046(A)
申请公布日期
1980.05.08
申请号
JP19780134163
申请日期
1978.10.30
申请人
MITSUBISHI ELECTRIC CORP
发明人
HATSUTA MUNEO
分类号
H01L23/52;H01L23/32
主分类号
H01L23/52
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Lubricating oil additive, lubricating oil and working fluid for refrigerators
Modular block retaining wall
Chemical compounds
Individual septum capped microtubes
Improvements in or relating to castor wheels
MULTI FUNCTIONAL GLUE OF WASHER
UP/DOWN TYPE DOOR OPENING/CLOSING SENSING DEVICE OF MICROWAVE OVEN
Reciprocating motor and compressor incorporating the same
Refrigeration appliance with improved lamp
The thermoplastic resin composition
DOOR OPENING/CLOSING CONTROL METHOD UPON COMPLETION OF COOKING IN MICROWAVE OVEN
DOOR LOCKING DEVICE OF MICROWAVE OVEN
Coating thickness gauge
Stirrer for microwave oven
System for smart card funds refill.
METHOD AND DATA CARRIER ASSEMBLY FOR VALIDATING MEMORY CHIPS
Wire drawing dies
Loudspeaker with short circuit rings at the voice coil
A Drug delivery composition for alpha-adreno receptor blocking agents
Variable spring rate compression element and riser tensioner system using the same