| 摘要 |
PURPOSE:To make soldering uniform and improve operational efficiency, by placing on a tray on which semiconductor pellets are arranged another tray having small holes corresponding to the pellets, and supplying melted solder on the surface of the pellets from the small holes in a furnace. CONSTITUTION:Each pellet 1, with its gold-plated back side up, is placed in each square depression 2, slightly larger than pellet 1, provided on tray 3. On tray 3 is place tray 5, which has many holes 6 corresponding to the positions of the pellets. Each hole 6 contains small solid solder piece 4. It is conical and has opening 7 on its bottom. The positions of 2 and 6 are fitted, and then this structure is placed in a hydrogen furnace. Small solder piece 4 melts and drops on pallet 1. Subsequently, the structure is taken out from the furnace. The solder solidifies, and solder layer 8 is formed on the gold-plated layer on the back of pellet 1. |
