| 摘要 |
<p>PURPOSE:To enable bonding length to be increased, in a wiring structure of 1-raw multi-dot thermal head, by connecting heat-generating elements corresponding to 2nd, forward block on the same substrate and reversing wiring direction by blocks. CONSTITUTION:4 Pieces of heat-generating bodies constitute 1 block, and signal- and-power supply lines 601-604 for No. 1, No. 3 and No. 5 blocks numbered from the left in the sketch are provided on the top, and signal-and-power supply lines 601'-604' for No. 2, No. 4 and No. 6 blocks are provided on the bottom. In general, heat-generating bodies corresponding to i-th block abd (i+2)-th block are connected on the substrate through diodes. A multi-layer wiring is to be composed of an insulation plate 51 provided with lead wires 611-614 and an insulation plate 52 provided with lead wires 621-624. By doing this, it is possible to provide a lead wire bonding interval as large as 1 block of the heat-generation line.</p> |
