发明名称 |
Semiconductor device and a method of manufacturing the same |
摘要 |
A semiconductor device includes at least two different elements having different functions. At least one of the elements is fixed within a recess provided in a substrate, and wirings are provided on an insulating film deposited commonly on the elements and the substrate, so that there is no step or clearance between the elements or between the element and the substrate, making it possible to easily form good interconnections.
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申请公布号 |
US4199777(A) |
申请公布日期 |
1980.04.22 |
申请号 |
US19770764845 |
申请日期 |
1977.02.02 |
申请人 |
HITACHI LTD |
发明人 |
MARUYAMA, EIICHI;YAMAMOTO, HIDEAKI |
分类号 |
H01L27/15;H01L23/14;H01L23/538;H01L25/16;H01L27/146;H01L29/267;H01L31/00;H01L33/00;(IPC1-7):H01L29/06 |
主分类号 |
H01L27/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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