发明名称 Method of making a planar semiconductor on insulating substrate device utilizing the deposition of a dual dielectric layer between device islands
摘要 A method of making a monolithic semiconductor-on-insulator device which includes silicon islands in spaced relation on the surface of an insulating substrate includes the steps of filling the spaces between the islands with a passivating material by first depositing a layer of a semi-insulating material on the surface of the substrate and extending between adjacent islands into contiguous relation with the side surfaces thereof and then depositing a layer of insulating material on the layer of semi-insulating material. The combined thicknesses of the layers of semi-insulating and insulating material is substantially the same as the thickness of the silicon islands so that the resulting device has a substantially planar surface.
申请公布号 US4199384(A) 申请公布日期 1980.04.22
申请号 US19790007579 申请日期 1979.01.29
申请人 RCA CORP 发明人 HSU, SHENG T
分类号 H01L21/314;H01L21/762;H01L21/86;(IPC1-7):H01L21/20;H01L21/84;H01L29/04 主分类号 H01L21/314
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