| 摘要 |
This invention is concerned with a new class of polyetheramide-imide phenolic resin blends. More particularly, the invention is concerned with polyetheramide-imide phenolic resin blends which exhibit melt viscosities suitable for solventless-dry powder coating and curing of polyetherimide insulating films on various substrates. The polyetheramide-imide phenolic resin blends are also suitable for the manufacture of filaments, fibers, films, molding compounds, coatings, etc.
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