BONDING THERMOPLASTIC RESINS

摘要

The bonding between thermoplastic resins and inorganic oxide substrates is improved by providing at the resin/inorganic oxide interface as an adhesion promoter a combination of (a) a copolymer of an ethylenically unsaturated organic monomer and an unsaturated organosilane containing hydrolyzable groups; and (b) a monomeric hydrolytically reactive organosilane. …A composition comprising a thermoplastic resin, the copolymer and the organosilane has been found to have good bond strength with inorganic oxide substrates.